In semiconductor chip materials, why are target materials important?

Semiconductor materials can be categorized as wafer materials and packaging materials. anti vibration table While packaging materials have lower technical barriers compared to wafer manufacturing, this discussion will mainly focus on the latter. Wafer production entails the use of seven different semiconductor materials and chemicals, each with a significant share in the semiconductor market: 33% for silicon wafers, 17% for special gases, 15% for masks, 13% for ultra-clean and high-purity reagents, 7% for polishing fluids and pads, 7% for photoresist materials, and 3% for sputtering targets.

The focal point is the substance utilized in creating the film, utilizing a range of laser (or ion beam) and targets to achieve various types of films with conducting and blocking abilities. This substance is commonly referred to as a "sputtering target". semiconductor test Its function involves utilizing ions from an ion source to gather and accelerate within a vacuum, directing them towards the target's surface to exchange kinetic energy and deposit atoms onto a substrate.

As the semiconductor industry advances, so do high-purity sputtering targets, particularly in the integrated circuit sector. As information technology continues to evolve, integrated circuits are increasingly requiring more intricate integration. These circuits typically consist of a substrate, insulating layer, dielectric layer, conductor layer and protective layer. The medium layer, conductor layer and even protective layer are all produced through sputtering coating processes, making sputtering targets a crucial material in integrated circuit manufacturing.

Based on students' varying chemical makeup, sputtering targets for semiconductors can be categorized into two types: metal targets (pure aluminum, titanium, copper, tantalum, nickel, etc.), alloy targets (such as nickel-vanadium and nickel-platinum alloys), voltage probe and ceramic composite targets (such as ITO, IGZO, and GST). These targets serve various practical and research purposes in different fields, including Chinese semiconductor technology chip target, planar touch target, information storage target, electronic control device target, and more.

What metals are used in advanced manufacturing processes? How do you choose which metal to use on a few inches of sheet? In the semiconductor industry, wafers 200mm (8 in) and below are typically made of aluminum, with titanium and aluminum as the main targets. The majority of 300 mm (12 in) wafers, however, are produced with copper and tantalum targets using advanced copper process technology.

Shortly, as chips are used more and more widely, the chip market is growing, aluminum, titanium, tantalum, copper, these mainstream film metals will become increasingly popular, the target purity requirements are high, generally in the range of 5N(99.99%) or higher. For now, these four membrane materials do not have any technological or economic substitutes, so they are unlikely to be replaced.