What are the basic design principles of multi-layer PCB?

A good electronic instrument, in addition to the selection of high-quality components, reasonable circuit, printed circuit board component layout and electrical connection direction of the correct structural design, but also to determine whether the instrument can work reliability is a key issue, different component layout design and PRZEWOD direction will produce different results,multilayer pcb fabrication the results may be very different. Correct component layout, reasonable wiring direction, not only can eliminate noise interference caused by improper wiring, but also facilitate installation, commissioning and maintenance. This paper introduces the basic principles of PCB design.

What are the basic design principles of multi-layer PCB?

(1) printed circuits need to cross the line, you can use "drill", "winding" two management solutions. Complex system circuits, but also through a small amount of money to use jumper wires.

(2) Resistors and diodes can be mounted "vertically" and "horizontally". The advantage of vertical is space saving, and the advantage of horizontal is better mechanical strength.

(3) The grounding points of circuits of the same level are as close as possible to each other, and the filter capacitors of that level are connected to the grounding points of that level. In particular, this level of transistor B, e ground point can not be too far away, otherwise the copper foil is too long will cause interference and self-excitation, the same level of "one point ground", not easy to self-excite.

(4) the total ground personnel must be strictly according to the high-frequency - mid-frequency - low-frequency level by level of weak power to strong power in the order of arrangement, level and level rather than long wiring, but also through the compliance with the provisions of this system of society. Especially for high-frequency circuit grounding line arrangement work requirements students need to be more stringent, very easy to lead to the generation of self-excitation, often using a large area surrounded by ground to ensure a good shielding effect.

(5) high-current leads (public ground, power amplifier power leads, etc.). Should be as wide as possible, in order to reduce the wiring resistance and its voltage drop, reduce the self-excitation caused by parasitic coupling.

(6) High-impedance alignments susceptible to interference can be as short as possible, low-impedance alignments (power lines, ground lines, base and emitter current leads of non-feedback control elements), etc. can be longer.

(7) Try to shorten the connection between high-frequency components and minimize their distribution parameters and electromagnetic interference. Sensitive components should not be too close to each other, and input and output components should be as far away as possible.

(8) Try to shorten the connection lines between high-frequency components and minimize their distribution parameters and electromagnetic interference with each other. Components susceptible to interference should not be too close, and input and output components should be as far away as possible.

Hunting board is committed to providing customers with multilayer board special process customization services, to solve the enterprise multilayer board production problems, users are welcome to consult.

Customized process to find the hunting board

1. Support 1-14 layers of small and medium-sized orders,PCB factory more floors consulting customer service;

2. HDI blind hole buried technology can be realized;.

3. using Taojian A grade board (KB-6164) as the board, which can be used as halogen-free board;

4. Maximum size is 1 meter;.

5. Ink colors such as pink, transparent, and purple;

6. support copper thickness of 10 ounces and aperture diameter of 35 microns; and

7. said multilayers can be customized according to the pressing structure;.

8. support multi-level impedance matching;

9. Board edge copper overlay, two-color ink, plug holes, countersunk holes, square slots, stepped holes, stepped slots, nickel-palladium gold and other special processes;

10. A set of PCBA stickers, single and double-sided stickers;